Circuit layout methodology using via shape process

ABSTRACT

A circuit layout methology is provided for eliminating the extra processing time and file-space requirements associated with the optical proximity correction (OPC) of a VLSI design. The methodology starts with the design rules for a given manufacturing technology and establishes a new set of layer-specific grid values. A layout obeying these new grid requirements leads to a significant reduction in data preparation time, cost, and file size. A layout-migration tool can be used to modify an existing layout in order to enforce the new grid requirements.

RELATED APPLICATIONS

This application is a divisional of U.S. application Ser. No. 10/906,591, filed Feb. 25, 2005.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to a circuit layout methodology for an integrated circuit (IC), and more particularly pertains to a circuit layout methodology for developing a layout for a very large scale integrated circuit (VLSI) with a set of reduced layout grid ground rules. The circuit layout methodology starts with the design rules for a given technology for fabricating an IC, and establishes a new set of layer-specific layout grid values. A circuit layout obeying these new layout grid requirements leads to a significant reduction in data preparation time, cost, and file size. The present invention can be used for migrating an existing VLSI layout to a set of reduced layout grid ground rules. A layout-migration tool can be used to modify an existing IC layout in order to enforce the new layout grid requirements. A layout-optimization application can be used to rescale data, thus changing the layout grid size, and also adjusting the minimum line widths and minimum line spaces, and a shapes-processing application can be used to adjust via sizes, locations and borders.

2. Discussion Of The Prior Art

For any given technology for fabricating an IC on a wafer, (e.g. Intel Pentium™ microprocessor), a layout grid is defined for that technology. The layout grid represents the smallest dimensions that can be used by designers in layout data for each level in that technology. For a 130 nanometer (nm) generation technology, that value is approximately 0.01 microns. For wires and vias, this means that their widths and spacing are changed in 0.01 micron increments (e.g. 0.99, 1.00, 1.01 microns).

In addition, each technology for fabricating an IC specifies ground-rule values for minimum line width and minimum line spacing for each metal layer (M1 (the first and lowest metal layer), M2 (the second, next higher metal layer) and for each via layer (Vi (the via layer connecting M1 to M2), V2 (the via Layer Connecting M2 to M3)), etc. For a 130 Nanometer (nm) Generation Technology, These Ground-Rule Values Are:

-   -   Mi minimum line width and line space—0.16 microns,     -   M2 minimum line width and line space—0.20 microns,     -   M3 minimum line width and line space—0.20 microns,     -   Vi minimum line width and line space—0.20 microns,     -   V2 minimum line width and line space—0.20 microns, etc.     -   For a 65 nm generation CMOS technology, the above values for a         130 nm generation CMOS technology are reduced by approximately         one half.

It is apparent that the permitted feature sizes for wiring shapes are much smaller than the sizes actually required to draw wires in a VLSI layout, since for the exemplary 130 nm generation CMOS technology, the grid size is 0.01 microns and the N2 minimum line width and line space is 0.20 microns. The resolution enabled by the manufacturing layout grid size is in some sense unneeded for wiring levels, since the minimum line space and minimum line width ground rules for wires are large multiples of this fie grid size. The grid size is much smaller than the minimum feature size to allow for the use of optical proximity correction (OPC).

The end result of using OPC is that data volume and processing runtime increase unduly during data prep. This ultra-fine grid is necessary for the mask layers that require extensive OPC (such as the layers involved in forming devices) to account for photolithographic and etch problems, but such extensive OPC processing and ultra-fine grids are not normally necessary for the wiring layers.

SUMMARY OF THE INVENTION

The present invention relates generally to a circuit layout methodology for an integrated circuit (IC), and more particularly pertains to a circuit layout methodology for developing a layout for a very large scale integrated circuit (VLSI) with a set of reduced layout grid ground rules. The circuit layout methodology start with the design rules for a given technology for fabricating an IC, and establishes a new set of layer-specific layout grid values.

The present invention provides a technique for eliminating the extra processing time and file-space requirements associated with the OPC of a VLSI design, and can use a layout grid size that is equal to or not much smaller than the dimensions of minimum size feature. A methodology is described that start with the design rules for a given manufacturing technology and establishes a new set of layer-specific layout grid values. A circuit layout obeying these new grid requirements leads to a significant reduction in data preparation time, cost, and file size. Furthermore, a layout-migration tool can be used to modify an existing layout in order to enforce the new layout grid requirements. The penalty associated with these new grid requirements is that the chip size may increase because of the increased wire width and spacing.

The method proceeds as follows, for a given set of IC manufacturing ground rule values.

For the most critical layers such as PC (gate polysilicon conductor layer), RX (active silicon conductor layer that is surrounded by shallow trench isolation (STI) or field oxide) and Mi (first metal layer), a fine layout grid is required for accuracy in OPC. Use a fine layout grid for these layers, but ensure that interfaces to the layers above and below obey the layout grid constraints for the layers above and the layers below (e.g. PC-C1 (contact layer)-M1 or Mi-Vi-M2).

For each metal layer M2, M3, etc. in the IC technology, specify a new layout grid value Mx grid equal to an integral fraction of the minimum line space and line width (Mx.space) ground rules for that layer. For example, the Mxgrid can be chosen to be ¼, ⅓, 1/i, etc. of Mx . . . space. All coordinates for Mx shapes in the circuit design must then be multiples of Mxgrid.

For via layer Vi (first via layer), do not use an ultra-fine layout grid, use a layout grid that is a fraction (e.g. ¼˜⅓, ½, etc. of the M2 . . . grid value.

For via layers V2 (second via layer), V3 (third via layer), etc., use the corresponding layout grid of the metal layer below. For example, use metal layer M2grid for via layer V2; metal layer M3 . . . grid for via layer V3, etc.

For Ci (contact layer between PC and M1) and Vi, do not use an ultra-fine layout grid. Use a layout grid that is a fraction (e.g. ¼k ⅓, V2 ) of the M2grid value.

These steps permit a set of ground rules for any IC fabricating technology to be used to create a new “OPC-efficient” set of rules for the same technology. And for a given layout in the existing ground rules for the technology, use hierarchical layout optimization techniques of a layout-migration tool to enforce the new set of rules.

The present invention greatly simplifies design/layout rules, and has the potential to significantly decrease data volume and mask designs with less complex OPC.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing objects and advantages of the present invention for a circuit layout methodology may be more readily understood by one skilled in the art with reference being had to the following detailed description of several embodiments thereof, taken in conjunction with the accompanying drawings wherein like elements are designated by identical reference numerals throughout the several views, and in which:

FIG. 1 illustrates a simplified example of a mask for an original wire and via layout before OPC.

FIG. 2 illustrates the wire and via layout of FIG. 1 after OPC, as is generally known in the art, in which some areas are added and other areas are removed.

FIG. 3 shows an illustrative starting first embodiment of the present invention for a 65 nm generation mask having different wire features A-D, with connecting vias 1-7.

FIG. 4 illustrates a modified second embodiment (modified relative to the first embodiment) having the same general wire features A-D and same general connecting vias 1-7 and a much smaller grid size.

FIG. 5 illustrates a modified third embodiment having the same general wire features A-D and same general connecting vias 1-7.

FIG. 6 illustrates a modified fourth embodiment having the same general wire features A-D and same general connecting vias 1-7.

FIG. 7 illustrates a modified fifth embodiment having the same general wire features A-D and same general connecting vias 1-7.

DETAILED DESCRIPTION OF THE INVENTION

For virtually all non-block mask layers/levels, i.e. wiring, vias, RX, PC, etc., layout grid sizes that are approximately 1/20th of a ground rule are commonly used to allow the use of optical proximity correction (OPC). For a 90 nm generation CMOS technology, the minimum ground rule is about 100 nm, and accordingly a layout grid size of 5 nm is used. Typically massive OPC is used to provide the densest possible wiring.

The present invention uses a coarse layout grid size with increased spacing between individual structures on each mask layer to avoid problems with electrical opens and shorts.

FIGS. 1 and 2 illustrate a simplified example of a mask before and after OPC processing. FIG. 1 illustrates a simplified example of a mask for an original wire and via layout before OPC. FIG. 2 illustrates the wire and via layout of FIG. 1 after OPC in which the areas 10 are added, and the areas 12 are removed. The OPC improves the lithographic printing of the wires, thus decreasing via to wire opens and wire to via short

Typically in OPC, as illustrated by FIGS. 1 and 2, shapes are either added to or removed from structures on a mask, with the shapes being defined by an integral number of grid points. For example, a line end extension might be added, ranging from 1 to 10 grid points (5 nm to 50 nm)₁ depending upon how much space there is to an adjacent line.

In addition, mask comps are commonly employed to slightly increase or decrease the width of mask shapes (typically <5 grid points). This conversion of simple shapes to more complicated shapes significantly increases the data volume and complexity, with resulting increased data preparation cost, increased mask build cost, and increased risk of making an error which results in a higher defect density on the wafer. The benefit of the conversion is that wire width and spacing requirements can be increased without increasing the chip size.

The present invention provides a set of migratable design rules that allow the use of a layout grid size equal to the minimum ground rule for a given technology. For simplicity, the explanation focuses on wiring masks and via masks, although the subject invention is applicable to all mask levels.

More specifically, the present invention provides a methodology for simplifying a circuit layout with layout rules that provide a layout grid size customized for each level based upon the pitch and minimum ground rules for that level.

In a broad aspect, the present invention:

-   -   1. develops a set of layout rules that selects a layout grid         size for a given level based upon the pitch and minimum ground         rules for that level.     -   2. applies the layout rules developed in step 1 to customize the         layout grid size (for at least one and normally more levels).     -   2. selects a layout grid size having a value that,         -   a) is greater than a minimum required offset for             manufacturing features             In a More Detailed Aspect, the Present Invention:     -   1. identifies the minimum line width/space (as defined for         example by         '/2 the minimum pitch).         (such as vias), and also         -   b) is a factor of the minimum line width/space, generally             between the minimum line width/space and ¼ the line width             space (¼, ⅓, ½, or ix).     -   3. lays out all wires using the selected grid size for         developing a new circuit layout, or for modifying an existing         circuit layout.     -   4. provides a minimum line width/space, with one (1) additional         grid point spacing being provided around manufacturing features         (such as wires under or over vias).     -   5. performs an optional data prep, which generally examines the         overall mask design and equalizes the pattern factor, which is a         ratio of print to non-print across the chip, by adding dummy         shapes to the mask, as is generally known in the art.

In cases where OPC is needed, start with steps 1-5 above, and add an additional second pass adjustment of the layout and the data prep with approximately 1/10 the line width/space grid to allow for rudimentary OPC.

The following is a discussion of several specific embodiments.

The contacted polysilicon (PC) level pitch defines the ground rules needed for wiring masks and via masks. For a 65 nm generation CMOS technology, the contacted PC level pitch is 160 nm (i.e. 80 nm line/space). Typically, for a CMOS BEOL (back end of line processing) with multilevel wiring, the wiring width/space/pitch are given in the following table.

In the following table, 1x via is the via layer that connects 1x wire (metal M) to 2X wire, 2X via is the via layer that connects 2X wire to 4X wire, and 4X via is the via layer that connects 4X wire to 6X wire, etc.

Level minimum width/minimum space Ml metal  80 nm 1x wire = 1x via 100 nm 2Xwire = 2Xvia 200 nm 4Xwire = 4Xvia 400 nm 6X wire = 6X via 600 nm

Two options are presented, a first option of using 100 nm spacing and a second option of using 200 nm spacing.

One simple algorithm available to design a drcuit layout and mask can use the ground rule width/space as the wiring layout and mask fabrication layout grid size (e.g. 80 nm for M1, 100 nm for ix wires, etc.).

A potential problem with this approach is that OPC would not be possible. A solution to that problem is to relax the wiring width/space rules such that the wire and via width remain unchanged.

The following is a specific example of how all mask levels in a 65 nm generation CMOS design can be specified. It should be realized that there are an unlimited number of possible masks in different technologies by different manufacturers, and the following is a very specific example of a typical CMOS technology.

-   -   for very critical masks such as RX, PC and NIL, use a         traditional 5 nm grid size, but allow the layout to fit wit a         relaxed grid size for other mask levels by constraining         interfaces between RX, PC, M1 and front end of line processing         (FEOL) block masks or CA/Mi back end of line processing (BEOL)         masks,     -   for FEOL block masks, use a 100 nm grid size,     -   for BEOL CA mask, use a 25 nm grid size,     -   for BEOL ix wire masks (M2+), use a design grid size of 100 nm         and a data prep grid size of 10 nm, for BEOL ix via masks (V1+),         use a design grid size of 100 nm,     -   for BEOL 2X via and wire masks, use a design grid size of 200         nm,     -   for BEOL 4x via and wire masks, use a design grid of 400 nm,     -   for BEOL 6x via and wire masks, use a design grid of 600 nm.

Generically, considering the unlimited number of possible masks in different technologies by different manufacturers, the present invention classifies each mask according to four general parameters, minimum line size, minimum space size, minimum border for upper layers, and minimum borders for lower layers.

The following is a basic description of the present invention as used to develop a new circuit layout or to modify an existing circuit layout:

1) Define an integrated circuit containing N mask levels, where N>>1 (e.g. 50 for a 10 metal level chip).

2) Divide the masks into different groups, based on whether they are (a) used to provide connection between vertically adjacent levels (contact layers); or (b) used for horizontal patterning (wire layers); or (c) used to pattern alignment aids. Examples:

-   -   (a) vertical connection masks: vias between wiring levels;         contacts to active or passive devices; MOSFET         gates/source/drain; NPN emitter/gate/collector; passive         resistors; passive capacitors; etc.     -   (b) horizontal patterning masks: gate conductors in MOSFET         transistors; base or emitter conductors in NPN transistors; ion         implant patterning mask; wire level mask; shallow trench         isolation; etc.     -   (c) alignment aids: mask used to pattern and etch alignment aids         for metal-insulator-metal (MIM) capacitors in the optical ken,         etc.

3) Define the critical dimension for each mask as the minimum resist line or space that must be printed using each mask. Determine the minimum critical dimension for each mask, and identify the overall mask set minimum critical dimension. Require that each mask be laid out using integer multiples of the minimum critical dimension.

4) Normalize the critical dimension for each mask by the overall mask set minimum critical dimension defined above in 3. This will result in each mask having a normalized critical dimensions >=1. For a CMOS technology with multiple levels of hierarchical wiring, this will result in normalized critical dimensions in the range of 1.10, where numbers larger than one are not required to be integers.

5) For all of the masks defined above, use a grid size equal to the critical dimension for each mask (if the masks are greater or less, use with lithography exposure tools which are greater or less than 1:1, adjust the grid size accordingly, as is known in the art).

option: the grid size could be equal to ½ (or ⅓, ¼, etc.) the minimum critical dimension for the mask and the layout rues described above would allow for horizontal features which are 1.5, 1.33, 1.25, etc. (or 0.7, 0.67, 0.75, etc.) times the minimum critical dimension for each mask.

6) The vertical connection masks, defined in 2a above, are used to fabricate vias or contacts between vertically adjacent levels on the wafer. To reduce or eliminate the possibility of either small contact area or opens (the via or contact partially contacting or missing the horizontal structure above or below), or unintended short between the contacts or vias and adjacent horizontal patterning features require:

-   -   option a) that the layout used for the horizontal patterning         mask features contain borders above and below the contacts or         vias which are equal to one grid point per edge as defined in 5         above and the via is greater or equal to 1 grid point away from         all edges (i.e. the horizontal patterning feature which is         coincident with a contact or via is bordered by one grid point         on all sides of the via or contact). No data preparation or         optical proximity correction would be employed prior to mask         fabrication.     -   option b) that the minimum horizontal patterning mask feature         width, for features that coincide with a contact or via above or         below, be 2 grid points wider than the contact or via; and that         the contact or via be centered in the horizontal patterning         feature (i.e. the horizontal patterning feature which is         coincident with a contact or via is bordered by one grid point         on all sides of the via or contact). No data prep or optical         proximity correction would be employed prior to mask         fabrication.     -   option c) that the minimum horizontal patterning mask feature         width be 2 grid points wider than the minimum critical dimension         and that the contact or via be located such that it always is         bordered by 1 or more grid points.     -   option d) that the minimum horizontal patterning mask space         width between features be 2 grid points wider than the minimum         critical dimension.     -   option e) that all features on the horizontal patterning mask         have spaces between them greater or equal the minimum critical         dimension defined in 3 above, plus 2 grid points; and that all         contacts or vias be centered in the horizontal patterning         feature. Prior to mask fabrication optical proximity correction         would be employed. The OPC would consist of bordering each         contact or via by one grid point on all sides, with the grid         point defined in 5 above.

The present invention provides a method for developing or modifying a layout for fabricating a very large scale integrated circuit in a plurality of different layers having a plurality of masks for the different layers, in a given IC technology with a set of reduced ground rules for layout grids for the plurality of different layers. Following step 2) above wherein the plurality of masks are classified into different groups, depending upon which group a mask is classified into, use the design rules for the given IC technology to establish a layer-specific layout grid increment value for that mask, to develop a plurality of layer-specific layout grid increment values for the plurality of masks. Then use a layout-optimization application to scale data and select the size of the layout grid increment value for at least some of the plurality of different layers of the VLSI layout while also enforcing other constraints such as area growth or electrical properties. Then use a layout-optimization application to select minimum line widths and minimum line spaces for at least some of the plurality of different layers of the VLSI layout. Then use a shape-processing application to select via sizes, via locations, and via borders for at least some of the plurality of different layers of the VLSI layout.

In implementing the present invention, the layout database might be split across different files with different representations of minimum feature size.

Pursuant to the present invention, the grid size at any mask level of a multilevel IC should be an integer divisor of a larger grid size at another mask level. Moreover, at each mask level, the minimum line width and the minimum line space are preferably the same. If they are not the same, then the grid size should be an integer divisor into both the minimum line width and the minimum line space. For example, for a 200 nm minimum pitch level, the minimum line width and the minimum line space could be 100 nm. Alternatively, the minimum line width could be 125 nm and the minimum line space could be 75 nm, with a grid size of 25 nm which is an integer divisor into both 125 nm and 75 nm.

The following Table 1 refers to and describes embodiments 1-5 shown respectively in FIGS. 3-7, wherein embodiment 1 shown in FIG. 3 is a starting point for embodiments 2-5 shown in FIGS. 4-7.

Table 1 is a description of wire (142), via below M2 (Vi), and via above M1 (V2) layout rules for a 65 nm generation technology with nominal 100 nm wire and via minimum width and space.

Via to adjacent Wire to adjacent Border wire in a wire mm. Surrounding different network, Page 11 of 22 Narrow wire Embodiment via mm. space space end comp Grid size 1 (FIG. 3) 0 nm 100 nm i00 nm 0 100 nm 2 (FIG. 4) 25 nm 125 nm i00 nm 0 25 nm 3 (FIG. 5) 0 nm 125 nm 100 nm 0 25 nm 4 (FIG. 6) 25 nm 75 nm S0 nm 0 ZS nm 5 (FIG. 7) 0 nm 75 nm 75 nm 25 nm 25 nm

FIG. 3 shows an illustrative starting first embodiment of the present invention for a

65 nm generation mask having different wire features A, B, C and D, with connecting vias 1, 2, 3, 4,

5, 6 and 7. Note the very large grid size of 100 nm represented by the spaced array of grid points 30.

The vias 1-7 are 100 nm diameter and have 0 nm borders, and the wire to wire minimum space is

100 nm.

FIG. 4 illustrates a modified second embodiment (modified relative to embodiment 1) having the same general wire features A-D and same general connecting vias 1-7. Note the relatively smaller grid size of 25 nm represented by the spaced array of grid points 40. The vias 1-7 are 100 nm diameter and have 25 nm borders, and the wire to wire minimum space is 100 nm.

FIG. 5 illustrates a modified third embodiment having the same general wire features A-D and same general connecting vias 1-7. Note the small grid size of 25 nm represented by the spaced array of grid points 50. The vias 1-7 are 100 nm diameter and have 0 nm borders, and the wire to wire minimum space is 100 nm.

FIG. 6 illustrates a modified fourth embodiment having the same general wire features A-D and same general connecting vias 1-7. Note the small grid size of 25 nm represented by the spaced array of grid points 60. The vias 1-7 are 100 nm diameter and have 25 nm borders, and the wire to wire minimum space is 50 nm.

FIG. 7 illustrates a modified fifth embodiment having the same general wire features A-D and same general connecting vias 1-7. Note the small grid size of 25 nm represented by the spaced array of grid points 70. The vias 1-7 are 100 nm diameter and have 0 nm borders, and the wire to wire minimum space is 75 nm.

Table 2 is a description of masks used to fabricate an integrated circuit, nominal feature

size, and mask grid size using this invention and refers to from the embodiments of Table 1.

Mask Type 1 I 3 C1M1 4 1X-Via 1X-Wire 5 2X-Via 2X-Wire 6 4x-Via 4X-Wire 7 Passive MIM bot. plate Passive MIM top plate Passive thin film resistor Minimum embodiments 1 and 2 which are different Nominal Grid Size Grid Size Mask Level Feature Size emb. 1 emb. 2 RXDTPC 40 nm 20 nm S nm Blocks, OP 100 nm 100 nm 2S nm 80 nm 20 nm 20 nm 100 nm 100 nm 25 nm 200 nm 200 nm S0 nm 400 nm 100 nm 2 pm 1 pm 400 nm 2 pm

Mask type 1 encompasses RX=the shallow trench isolation, DT=one or more masks used for fabricating deep trench capacitors, and PC=the polysilicon or silicon used for the MOSFET gate, NPN emitter, etc.

Mask type 2 encompasses Blocks—the ion implantations used for silicon or polysilicon doping, and OP=silicon without silicide (e.g. resistor, bipolar junction transistor, etc.)

Mask type 3 encompasses C1—the contact between PC and M1, and M1=the first wire level.

Mask type 4 encompasses 1x-Wire=the next and subsequent wiring levels with 100 nm minimum feature size, and 1X-Via—vias to connect adjacent wiling levels.

Mask type 5 encompasses 2x-Wire, 2X-Via.

Mask type 6 encompasses 4x-Wire, 4X-Via, etc. define relaxed pitch wire and via levels.

Mask type 7 encompasses passive components with a relatively large feature size such as passive capacitors, resistors, etc.

While several embodiments and variations of the present invention for a circuit layout methodology are described in detail herein, it should be apparent that the disclosures and teachings of the present invention will suggest many alternative designs to those skilled in the art. 

1. A method for developing a layout for fabricating a very large scale integrated circuit (IC) (VLSI) in a plurality of different layers in a given IC technology with a set of reduced ground rules for layout grids, wherein the size of an increment in a layout grid represents the smallest dimension that can be used by a designer in layout data for that given IC technology, comprising: using design rules for the given IC technology to establish a set of layer-specific layout grid increment values for at least some of the plurality of different layers; using a layout-optimization application to scale data and select the size of the layout grid increment value for at least some of the plurality of different layers of the VLSI layout; using a layout-optimization application to select minimum line widths and minimum line spaces for at least some of the plurality of different layers of the VLSI layout; using a shape-processing application to select via sizes, via locations, and via borders for at least some of the plurality of different layers of the VLSI layout.
 2. The method of claim 1, further including for critical layers of the IC, including a gate polysilicon conductor layer, an active silicon conductor layer that is surrounded by shallow trench isolation or field oxide, and a first metal layer, using a fine layout grid increment value to provide accuracy in optical proximity correction (OPC), while ensuring that interfaces from each critical layer to above layers and below layers of the IC obey layout grid constraints for the above layers and the below layers.
 3. The method of claim 1, further including for each metal layer above the first metal layer, use a layout grid increment value equal to an integral fraction of the minimum line width and line space for that layer.
 4. The method of claim 1, further including for a first via layer, use a layout grid increment value that is a fraction of the new layout grid increment value, and for via layers above the first via layer, use the corresponding layout grid increment value of the next metal layer below.
 5. The method of claim 1, further including for a contact layer between the gate polysilicon conductor layer and the first metal layer, use a layout grid increment value that is a fraction of the new layout grid increment value. 